| Rigid PCB | Flex PCB | |
|---|---|---|
| Layers | up to 50L | up to 6L |
| Base Material | FR-4, Hi-Tg, Halogen-free, Metal core, Ceramic, Teflon, Polyimide | Polyimide, Polyester |
| Maximum Size | 546.1 x 622.4 mm (21.5" x 24.5") |
0.075 - 0.40 mm (0.003 - 0.016") |
| Finished Board Thickness | 0.3 - 5.0 mm (0.012 - 0.197") |
±0.05 mm / ±0.10 mm |
| Board Flatness Tolerance | 0.50% | N/A |
| Inner Layer Copper Thickness | 4/4 oz | 0.5/0.5 oz |
| Outer Layer Copper Thickness | 5/5 oz | 1/1 oz |
| Minimum Finished Hole | 0.15 mm | 0.20 mm |
| Maximum Copper Wall Plating | 2 oz | N/A |
| Minimum Trace/Space (Inner Layer) | 3.0/3.0 mil | 4.0/4.0 mil |
| Minimum Trace/Space (Outer Layer) | 2.5/2.5 mil | 3.0/3.0 mil |
| Surface Finish | HASL/HASL (lead-free), ENIG, Immersion Silver/Tin, OSP, Gold plating, Gold finger, Peelable mask, Carbon ink | HASL/HASL (lead-free), ENIG, Gold plating, Immersion Tin, OSP |
| Impedance Control | ±10 % | N/A |
